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removed by various methods., Dual access is created by removing the coverlayer in the same area on both sides. Figure 66.1 indicates two basic structures of dual-access conductors, in both the single sided and double-sided types of flexible circuits. Figure 66.2 shows actual examples of the fine flying leads built on the single side circuits and double side circuits. Basically, a coverlayer is applied to the side of the conductive layer opposite the substrate.The coverlayer can be processed easily to create the top-side exposure. The flying lead is created when the base substrate is also removed in the same area.

FIGURE 66.3 Manufactuirng process for flying-lead flexiblse circuit construction using prepunching method.

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66.2.2 Manufacturing Processes for Flying Leads The fragility of flying leads, caused by the lack of dielectric support, is probably the largest disadvantage in the manufacturing process. Proper circuit design and layout is the key to the manufacturing process yield and subsequent cost and physical performance of the circuit. The most conventional manufacturing process for generating a flying-lead construction involves a pre-punching process similar to the device hole process of tape automated bonding (TAB). Figure 66.3 shows this process schematically. There is no proprietary technology or special tooling required for manufacturing the pre-punched window in the base substrate. This process, however, offers the manufacturer very little flexibility and is fairly labor intensive, which makes it difficult to maintain high productivity rates. The handling of unstable punched films, along with thin, fragile copper foils, makes it difficult to achieve the high manufacturing yields required to support the cost model associated with high-density flexible circuits. These unstable film substrates also make it difficult to maintain dimensional accuracy between the fingers and the window, a key element for HDI flexible circuits. Adhesive flow or squeeze-out from the edge of the punched film along the conductor can also be an issue when dealing with small window exposures. Openings of less than 1.0 mm are difficult to create with high dimensional accuracy and yield. Alternative technologies have been developed to generate high-density flying-lead designs with higher accuracy. Laser ablation, plasma etching, and chemical etching are just a few of the possibilities and are illustrated schematically in Fig. 66.4. A comparison of small opening capabilities of each of the processes is illustrated in Fig. 66.5, while a comparison of the technical capabilities of the processes is shown in Table 66.1. With these manufacturing technologies, many kinds of flying-lead constructions became possible.

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FIGURE 66.4 Manufacturing process for flying lead flexible circuit construction using (a) laser ablartion and (b) plasma etching or chemical etching.

TABLE 66.1 Comparison of Flying-Lead Manufacturing Technologies Prepunching (NC routing) Minimum slit width (mm) Material availability Design flexibility Capability for high-density flying leads Technical hurdles Registration Damage on flying leads Process cost Investment for large volume 800 Fair Limited Limited Low Difficult Serious High Small Laser abrasion 50 Wide Wide Wide Fair Fair Small High High Plasma etching 100 Wide Limited Fair High Fair Fair Low High Chemical etching 70 Limited Limited Fair High Fair Fair Low Medium

Laser Abrasion The excimer laser process has the capability to generate small openings with clearly defined edges on high-density flexible circuits.The narrow slit openings can be made smaller than 50 mm wide. The excimer process is available for all types of flexible circuit materials with high accuracy and fine openings. A carbon residue, typically removed by a suitable wet cleaning process, is found around the edges of the openings. One of the biggest disadvantages of excimer laser system is its slow speed, which accounts for the high processing cost when dealing with larger openings. The UV:YAG laser process offers a higher productivity rate than the excimer laser for very small openings. It has the ability to cut both copper foil and organic substrate materials with

EXAMPLE 3-6 Let T ab be antisymmetric. Show that S[a Tbc] = 1 (Sa Tbc Sb Tac + Sc Tab ) 3