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Technology movement of TAB The TAB manufacturing technology has been experiencing a great progress since 1980s. However, it has been facing a turning point to change the basic process drastically for the finer circuitries. TAB s manufacturing capabilities are very different from traditional flexible circuits and they cover different application area as shown in Fig. 66.10. TAB has been focusing single side fine traces with flying lead constructions. It has advantages for the volume productions of the small size circuitries because of special reel-to-reel manufacturing. In early usage, only 35 mm wide web was available to have high dimensional stabilities. But the latest RTR manufacturing equipment can manage 155 mm wide materials to generate 40 microns pitch flying leads. Several new processes such as laser drilling and through hole plating have been introduced to produce double side TAB with fine flying leads. Forty microns pitch of traces is almost the technical limit to manage the fragile fine flying leads for both of manufacturing and termination.Therefore, the technology is moving to COF (Chip on Film), that does not have device holes and flying leads, to have finer traces than 40 microns pitches. The manufacturing process and materials do not have significant differences from the ocr sdk c# free Tesseract OCR - industry-fastest .Net OCR library
While Tesseract is certainly the best OCR library available so far, Tesseract.NET SDK is one ... Net SDK offers flexible and simple API with lots of high- and low- level text recognizing procedures. It is thanks to ... Net SDK - The C# PDF Library . c# ocr pdf imageFirst you need to check your project References . Is there "Emgu.CV.OCR" library if not kindly add it first. Then try the following code may it will ... 400 Web Width (mm) Now we use the antisymmetry of T , Tab = Tba , to write S[a Tbc] = 1 (Sa Tbc Sb Tac + Sc Tab Sb Tac + Sa Tbc + Sc Tab ) 6 1 = (2Sa Tbc 2Sb Tac + 2Sc Tab ) 6 1 = (Sa Tbc Sb Tac + Sc Tab ) 3 200 100 50 25 50 Circuit Density (micron pitch) roll-to-roll manufacturing process of the fine flexible circuits. On the other hand, the fine line capabilities of the flexible circuits have been getting better reducing their RTR web size. TAB and flexible circuits had different capabilities in the past. But they have been moving to the same fine circuit area, and there have not bee remarkable differences in their manufacturing processes as shown in Fig. 66.10. c# google ocr exampleDynamsoft .NET OCR library is a fast and robust Optical Character Recognition component that can be embedded into your application in C# or VB.NET. c# aspose ocr exampleNET wrapper here ... NET 2.0 Open Source OCR Library ... ABBYY CLoud OCR SDK http://ocrsdk.com/?gclid=CPr-vYKx6K8CFSRKpgodnA- ... A variety of shapes and materials for micro bump arrays on flexible circuits have been developed to accommodate specific applications. c# winforms ocrHow to use Tesseract OCR 4.0 with C#. Contribute to doxakis/How-to-use-tesseract-ocr-4.0-with-csharp development by creating an account on GitHub. windows.media.ocr example c#Web API test app for the OCR.SPACE Free OCR API as Visual Studio C# project. - A9T9/Free-OCR-API-CSharp. Varieties of the Bump Shapes and Applications There are several choices of places to build micro bumps on flexible circuits, as described in Chap. 64 (see Sec. 64.3.8). The same processes used to build ball grid arrays on rigid circuit boards are appropriate for flexible circuits with flexible photo-imageable solder mask. It is possible to build micro bumps on bare conductors using plating masks. Many micro bumps are built on fine flying leads without solder masks. A valuable construction of a flexible circuit is micro bumps built on the other side of the circuit through the dielectric layer.This can provide a reliable micro bump array because of the stable construction. Many different shapes have been developed for micro bump arrays. The fusing solder process can make a spherical bump shape easily. Electrical plating of copper, nickel, gold, and combinations of these elements can provide many varieties of bump shapes. Changing the combination ratios and other factors can generate flat disks, flat domes, straight columns, etc. (Fig. 66.11). The best combination can provide 100- to 150-mm-pitch micro bump arrays on 50-mm-thick dielectric layers. Most of the micro bump array constructions of flexible circuits have been developed for high-density termination (e.g., flip-chip, CSP, test probes, etc.). A suitable design shape and materials should be chosen according to the requirements of the termination. Several examples are shown in Fig. 66.12 FIGURE 66.12 Various micro bump arrays on flexible circuits (a): Column shape copper bump array on the bare traces (b): Column shape Ni/Au bump array built through covelay (c): Solder ball array built though base substrate(d): Combination of flying leads and solder ball array. No matter how prepared you are, well, stuff happens. If you apply good project risk management to your presentation, you can head off most big challenges. Previous chapters have addressed ideas to avoid problems, so some of these suggestions have already been addressed, and some of the ideas are new. Occasionally, situations are simply disasters, but most of the time, if you ve done your homework, you can pull off your presentation with style. Let s look at risks you can avoid, risks you can plan for, and then emergencies and situations that spell disaster. how to implement ocr in c# Windows-universal-samples/Samples/ OCR at master · microsoft ...
Contribute to microsoft /Windows-universal-samples development by creating an account on ... Ocr API . Optical character recognition ( OCR ) API allows for application ... then the subfolder for your preferred language (C++, C# , or JavaScript). tesseract ocr c# code project NET OCR Library API for Text Recognition from Images in C# & VB ...
6 Mar 2019 ... Provide robust .NET OCR APIs for accurate and fast text recognition. C# example shows how to extract text from image file using OCR library .
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