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the same as the material in Fig. 10.5. The impact of decomposition temperature when these materials are exposed to multiple thermal cycles to different peak temperatures is highlighted in Figs. 10.7 and 10.8. Figure 10.7 graphs cumulative weight loss (decomposition) for these materials when cycled repeatedly to a peak temperature of 235 C. Clearly, there is little impact on

329.29 C 326.48 C 99.03% 328.43 C 98.02% 330.37 C 94.99%

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Not all risks associated with your presentation are threats. Along with looking at the negative effects of risks, it s smart to think of the opportunities that can present themselves. Opportunities can come serendipitously, they pop up from scanning the environment for possibilities, and they simply show up when they say yes to situations that present themselves to us. You can create positive opportunties by being open to them. Serendipity occurs when you re looking for one thing and unexpectedly nd something else that turns out to be even more valuable than what you were expecting.

Weight (%)

FIGURE 10.5 Decomposition curve for a phenolic high-Tg FR-4.

336.26 C 98.95%

391.10 C

366.57 C 98.02% 95 405.13 C 94.99%

Weight (%)

80 0

300 200 Temperature ( C)

1 = g 2 = 1 2

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resin decomposition when the peak temperature reaches 235 C. Figure 10.8 presents the same results when the peak temperature is increased to 260 C. The increase in temperature to 260 C has a severe impact on resin decomposition for the traditional FR-4 materials as they experience multiple thermal cycles, especially the conventional high-Tg material (product C). The rapid degradation in material C after only a few thermal cycles highlights why this material is not recommended for lead-free assembly applications. Indeed, as more data are gathered, thermal cycling seems to have a much greater impact than even one cycle to a very high temperature, even if the cycling occurs for a long time. As an example, review Fig. 10.9, which plots decomposition versus time at different isotherm temperatures for a standard dicycured high-Tg FR-4 material (C in Figs. 10.7 and 10.8). In Fig. 10.9 it can be seen that relatively low levels of decomposition are experienced for extended time periods even at the 260 C and 275 C isotherm temperatures. This same material, C in Fig. 10.8, exhibits rapid decomposition when cycled up to 260 C and cooled to room temperature multiple times.

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Moisture Absorption As pointed out in Table 10.2, the vapor pressure of water at lead-free assembly temperatures 260 C, for example is much higher than at eutectic tin-lead assembly temperatures such as 230 C. Figure 10.10 plots the vapor pressure of water, in both mm Hg and psi, versus temperature. At 230 C the vapor pressure of water is near 400 psi. At 260 C, it is close to 700 psi. Therefore, any absorbed moisture within a PCB during assembly can have a much greater impact in lead-free assembly, as the greater pressure stresses the adhesion between the base material components and can also create small voids within the resin system. This means that much more care must be used in selecting materials for their moisture absorption properties. However, all common base materials absorb some level of moisture.

To make serendipity more likely, constantly scan your environment, expecting to nd new opportunities everywhere. Do you remember the arm exercise described in 1 From the arm exercise, you learned that when you think negative thoughts, your body responds negatively and becomes weak. Conversely, when you think positively, your body becomes stronger. Since our thoughts in uence the way we respond, we get what we think about most. When you expect to nd new opportunities, they seem to pop up everywhere. Use that philosophy whenever you are called on to speak. Preparing your material might present an opportunity to call someone you ve wanted to meet. Most

100.2 100 99.8 Weight (%) 99.6 99.4 99.2 99.0 98.8 0 10 20 Time (min) 30 40 50 Universal V4.1D TA instruments 370std 230C 370std 245C 370std 260C 370std 275C

70,000 60,000 50,000 mm HG 40,000 30,000 20,000 10,000 0 0

1,400 Pressure, mm Hg Pressure, PSI 1,200 1,000 PSI 800 600 400 200 0 25 50 75 100 125 150 175 200 225 250 275 300 Temperature, C

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