rdlc data matrix

rdlc data matrix

rdlc data matrix

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Historical File Formats Descriptions Each format description that follows includes its domain (the elements that are covered), its history and expected future path, distinctive characteristics, and a short example. Format description references can be found at the end of the chapter. 18.3.2.1 Gerber (274D and 274X), Drill and Readme. Gerber formats are the lowest common denominator for passing bare-board fabrication information.They are composed of one file per graphic layer, one file for each drill layer, text files that list the PCB stack-up, and optional drawing files that list critical dimensions and requirements. Inclusion of a netlist file with each Gerber transfer is imperative to ensure correct board fabrication.

* See http://www.lookuptables.com/.

0.01 0.1 0.1

1 g 2

0.1 0.1

If one or two people in your audience walk out while you are presenting, remember that sometimes people need to leave for personal reasons having nothing to do with you or your presentation. The best thing you can do is honor their need to go and perhaps reschedule time with them. However, if several people unexpectedly head for the door, you might want to stop and ask for feedback from those who are headed out. Did you say or do something that was misinterpreted If anyone in the audience responds to you, you ll have valuable information to correct the situation. You might nd out that the people were just in the wrong room. If you don t get any feedback and the rest of the audience is still interested, use humor to regain your

1.3.3 Analytical Methods for RoHS Compliance The RoHS legislation does not set forth specific recommendations for analysis, nor is there wide consensus within the electronics community on standard analytical screening methods for determining compliance with RoHS legislation. Simple wet chemistry spot tests can be conducted for presence or absence of Cr+6, Hg, Cd, and Pb. These tests, if conducted properly, have good sensitivity for qualitative analysis. Atomic absorption spectrophotometry (AAS), x-ray fluorescence (XRF), energy dispersive spectroscopy (EDS or EDAX), infrared (IR) or ultraviolet (UV) spectrophotometry, and gas chromatography-mass spectroscopy (GC-MS, that is effective for PBB or PBDE) are but a few of the methods requiring expensive analytical instrumentation. Quantitative data can be gleaned from these and other methods, but capital investment is high, trained personnel are required, and use of traceable calibration standards are a must. 1.3.4 Exceptions and Exclusions The RoHS legislation exempts numerous applications of the four targeted elemental species. Most are not relevant to the discussion of printed circuit board soldering. Relevant applications are listed in Table 1.3.

TABLE 1.3 RoHS Exemptions as per the Second Amendment of RoHS Legislation* Lead in high melting temperature type solders (i.e., lead-based alloys containing 85 percent by weight or more lead) Lead in solders for servers; storage and storage array systems; network infrastructure equipment for switching, signaling, and transmission; and network management for telecommunications Lead in electronic ceramic parts (e.g., piezoelectronic devices) Lead as a coating material for the thermal conduction module c-ring Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 percent and less than 85 percent by weight Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91-338-EEC

* Source: L 280-18 EN Official Journal of the European Union 25.10.2005, 2nd Amendment Annex to Directive 2002-95-EC.

It should be noted that even in cases where Pb is removed from a component or solder, that the package must be otherwise RoHS-compliant Although counterintuitive, the directive declares an exemption for Pb-based interconnects where the Pb content is greater than 85 percent This exemption is meant to address specific devices, such as ceramic ball grid arrays (CBGAs), ceramic column grid arrays (CCGAs), flipchip devices, and other high-Pb interconnection schemes CBGAs and CCGAs rely on high Pb-content balls or columns, respectively, which melt at higher temperatures than eutectic Sn-Pb and thus will not collapse upon reflow Since these ceramic devices are heavy, if the solder balls or columns beneath were to collapse, then interconnect-to-interconnect shorting would take place Several years are typically needed to determine reliability impact of metallurgical changes to IC packages.

In the case of these area-array devices, the high-lead content solder connection is an integral part of the package and not just a link between a component lead and bonding pad on a circuit board Further, these packages are generally used in high-end systems such as telecommunications equipment and powerful computers The RoHS legislation exempts such equipment from restrictions on Pb until 2010 In the meantime, package manufacturers are working to find and test reliable replacements for Pb-based solders for high-end packages Some smaller ICs have already made the switch to Pb-free interconnects Other exclusions or exemptions detailed in the current RoHS directive are Cd and Pb in batteries, Pb in video monitor screens, and Hg in fluorescent light bulbs.