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Additionally, the specific construction of the PCB in terms of resin content, the types of fiberglass cloth used, and the adhesion and long-term thermochemical compatibility between the resin system and copper which is plated within vias can have a significant impact on longterm reliability. Some of these factors relate to the impact they have on CTEs, both in the z-axis as well as in the x- and y-axes. For example, using a very high resin content prepreg layer adjacent to a very low resin content layer increases the stress at the interface of these layers due to the differences in thermal expansion that result from the differences in resin-to-glass concentrations.The higher temperatures of lead-free assembly result in a greater absolute level of expansion or stress at these interfaces, which can lead to blistering or delamination. The distribution of the glass filaments within the resin system can have a similar effect. Within a given layer or prepreg, if there are resin-rich versus glass-rich areas, the differences in thermal expansion between these areas cause stresses that can lead to delamination, or at the interface with a plated-through hole (PTH) will result in points of stress-strain discontinuity resulting from differences in the z-axis expansion values. It is not uncommon to see cracks in the PTH copper begin at these points and ultimately lead to failure. Section 10.5 discusses the material properties relevant to both surviving lead-free assembly as well as ensuring long-term reliability. Although the test methods used to assess longterm reliability are beyond the scope of this chapter, where relevant, a brief description will be provided to help explain performance differences. However, before discussing these properties in more detail, Section 10.4 presents some of the concerns related to the components used to make base materials. barcodelib rdlc C# RDLC Report Barcode Control - BarcodeLib.com
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barcodelib.barcode.rdlc reports.dll Statistics in Java Integrate Code-128 in Java Statistics. 2003 John Wiley & Sons, Ltd. using regular visual studio .net crystal ... The higher temperatures of lead-free assembly have an impact on each of the three main components of laminate materials: the resin system, the glass cloth, and the copper foil. Table 10.1 summarizes the key issues for each of these main components. print barcode rdlc report ReportViewer - barcode not showing nor printing - MSDN - Microsoft
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Apr 28, 2007 · In the following Step-By-Step Guide we'll create a local report (RDLC file) which features barcoding capabilities by using Barcode Professional ... Substantial work describing the impact of lead-free assembly temperatures on base materials and finished PWBs has been gathered.2,3,4,5,6,7 These works have identified the critical base material properties that must be considered when selecting a material for lead-free assembly applications, though work on this subject is continuing. Table 10.2 provides a summary of these properties. A very critical point that must be emphasized with respect to these issues is that although laminate manufacturers can easily make improvements in one property, doing so often can adversely affect other important properties. For example, it is relatively easy to formulate a resin system with a very high time to delaminate in conventional T260 or T288 tests, or to engineer a resin system with a very high decomposition temperature. However, this is often rdlc barcode c# C# RDLC Report Barcode Control - BarcodeLib.com
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RDLC Barcode Generator Tutorial | Generate & Create Linear, 2D Barcodes in RDLC report files using RDLC Barcode Control SDK (dll) TABLE 10.1 Primary Lead-Free Issues for Base Material Components Component Resin System Lead-Free Assembly Impact 1. Peak assembly temperatures can reach point where resin decomposition begins. 2. Higher temperatures result in increased thermal expansion and stress on plated holes as a result. 3. Vapor pressure of absorbed moisture is much higher at lead-free assembly temperatures; can lead to blistering/delamination. 4. Phenolic lead-free compatible materials are often not as good for electrical performance, especially Df. Thermal and mechanical stress on resin-to-glass bond. Volatilized components can also stress this bond. Thermal and mechanical stress on resin-to-copper bond. Potential Solutions 1. Formulate resin system with higher decomposition temperatures. 2. Formulate for lower coefficients of thermal expansion. 3. Evaluate materials for moisture absorption/release characteristics; drying processes in PCB fabrication and/or assembly. 4. Evaluate non-dicy/nonphenolic laminate materials. Related Considerations 1. Reformulation can adversely affect electrical properties and manufacturability. 2. Can also impact mechanical properties and manufacturability. 3. PCB storage conditions during manufacturing and prior to assembly are much more important, especially humidity conditions. 4. Cost/performance tradeoff. New materials now available that offer more choices. Loss of resin-to-glass adhesion through thermal cycling could impact CAF resistance. Roughness impacts signal attenuation, especially at high frequencies.1 Cleanliness, moisture resistance, and choice of proper coupling agent for resin adhesion are more important. Copper nodularization and roughness, treatments for improved adhesion, i.e. coupling agents. achieved at the expense of mechanical properties and can make the material more difficult to use successfully in conventional PWB manufacturing processes, or without sacrificing design flexibility. Interactions between these and other material properties such as hardness, modulus, and fracture toughness with the processes used in PCB fabrication can greatly influence the reliability of a PCB during and after assembly. For example, an increase in decomposition temperature with a simultaneous decrease in fracture toughness does little good if the PCB exhibits cracking or fracturing during scoring processes or similar defects during the mechanical drilling of tight pitch holes for PTHs. Therefore, achieving the best balance of properties to meet the needs of the OEM, Electronic Manufacturing Services company (EMS), and PWB manufacturer is absolutely critical. rdlc barcode report How to print barcode in RDLC local report in Windows Forms
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