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Often used to refer to any process that is designed to be compatible with lead-free alloys LEADED CHIP CARRIER: A chip carrier (either plastic or ceramic) with compliant leads from terminations LEADLESS CHIP CARRIER: A chip carrier (usually ceramic) with integral metallized terminations and no compliant external leads LEGEND: A format of lettering or symbols on the printed board, for example, part number, component locations, or patterns LOOSE FIBERS: Supporting fibers in the substrate of the laminate which are not held in place by surrounding resin MAJOR WEAVE DIRECTION: The continuous-length direction of a roll of woven glass fabric MARGIN RELIEF: The area of a drill bit next to the cutting edge is removed so that it does not rub against the hole as the drill revolves.

MASTER DRAWING: A document that shows the dimensional limits or grid locations applicable to any or all parts of a printed wiring or printed circuit base It includes the arrangement of conductive or nonconductive patterns or elements; size, type, and location of holes; and any other information necessary to characterize the complete fabricated product MEASLING: Discrete white spots or crosses below the surface of the base laminate that reflect a separation of fibers in the glass cloth at the weave intersection MICROSTRIP: A type of transmission line configuration which consists of a conductor over a parallel ground plane separated by a dielectric MICROVIA: Usually defined as a conductive hole with a diameter of 0006 in or less that connects layers of a multilayer PWB Often used to refer to any small-geometry connecting hole the creation of which is beyond the practical capabilities of traditional mechanical drilling processes.

MINOR WEAVE DIRECTION: The width direction of a roll of woven glass fabric MIXED ASSEMBLY: A printed wiring assembly that combines through-hole components and surface mounted components on the same board MODULUS OF ELASTICITY: The ratio of stress to strain in a material that is elastically deformed MOISTURE RESISTANCE: The ability of a material not to absorb moisture either from air or when immersed in water MOUNTING HOLE: A hole used for the mechanical mounting of a printed board or for the mechanical attachment of components to a printed board MULTILAYER BOARD: A product consisting of layers of electrical conductors separated from each other by insulating supports and fabricated into a solid mass Interlayer connections are used to establish continuity between various conductor patterns MULTIPLE-IMAGE PRODUCTION MASTER: A production master used to produce two or more products simultaneously NAILHEADING: A flared condition of internal conductors..

Numerically controlled Usually refers to a machine tool, in this case a drilling machine The most basic type is one in which a mechanical guide locates the positions of the holes NC machines are usually controlled by punched tape NEMA STANDARDS: Property values adopted as standard by the National Electrical Manufacturers Association NOBLE ELEMENTS: Elements that either do not oxidize or oxidize with difficulty; examples are gold and platinum OILCANNING: The movement of entry material in the z direction during drilling in concert with the movement of the pressure foot ORGANIC: Composed of matter originating in plant or animal life or composed of chemicals of hydrocarbon origin, either natural or synthetic PAD: See terminal area PADS ONLY:A multilayer construction with all circuit traces on inner layers and the component terminal area only on the surface of the board.

This construction adds two layers but may avoid the need for a subsequent solder resist, and since inner layers usually are easier to form, this construction may lead to higher overall yields PH: A measure of the acid or alkaline condition of a solution A pH of 7 is neutral (distilled water); pH values below 7 represent increasing acidity as they go toward 0; and pH values above 7 represent increasing alkalinity as they go toward the maximum value of 14 PHOTOMASTER: An accurately scaled copy of the artwork master used in the photo fabrication cycle to facilitate photo processing steps PHOTOPOLYMER: A polymer that changes characteristics when exposed to light of a given frequency PINHOLES: Small imperfections which penetrate entirely through the conductor PINK RING: The appearance of a halo of copper around the hole of a multilayer.

PWB PITS: Small imperfections which do not penetrate entirely through the printed circuit PLASTICIZER: Material added to resins to make them softer and more flexible when cured PLASTIC LEADED CHIP CARRIER (PLCC): A chip carrier packaged in plastic, usually terminating in compliant leads (originally J style) on all four sides PLATED-THROUGH HOLE: A hole in which electrical connection is made between printed wiring board layers with conductive patterns by the deposition of metal on the wall of the hole(See PTH) PLATING VOID: The area of absence of a specific metal from a specific cross-sectional area: (1) When the plated-through hole is viewed as cross-sectioned through the vertical plane, it is a product of the average thickness of the plated metal times the thickness of the board itself as measured from the outermost surfaces of the base copper on external layers.