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This trend led to the need for electronic assembly data, just as the artwork-to-laserplotter development in board fabrication led to the need for electronic fabrication data Bare board fabrication and board assembly share some common data elements but also have distinct data needs Examples of common elements are the outer circuit and mask layers and through-drill information Unique data elements are, for example, inner layers for board fabricators and component placement locations and functional component descriptions for assembly houses All these data elements are described in the next section..

IPC-SC-60: Post Solder Solvent Cleaning Handbook IPC-SA-61: Post Solder Semi Aqueous Cleaning Handbook IPC-AC-62: Post Solder Aqueous Cleaning Handbook IPC-CH-65: Guidelines for Cleaning of Printed Boards and Assemblies IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies IPC-SM-785: Guidelines for Accelerated Surface Mount Attachment Reliability Testing IPC-9151: Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database JEDEC JESD 22-A113: Preconditioning Of Nonhermetic Surface Mount Devices Prior to Reliability Testing JEDEC JESD 22-B113: Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products

Phrases or examples that a dressmaker from Dusseldorf might use may be incomprehensible to a dressmaker from Dayton. Regional differences can be as extreme as national distinctions. When someone in the Midwest buys a box of Cheerios, it goes home in a sack. In Philadelphia, the same cereal is put into a bag. Caution! Don t assume too much on the basis of demographics. When you re speaking to a group of teens, don t assume that they all see the world in the same way, listen to the same music, or wear the same fashions. If you re speaking to a group of sixty- ve-year-olds, don t assume that they re all retired or even want to retire. Assuming too much is a primary cause of foot in mouth disease. Use demographic information only as a guideline when preparing and addressing your audience.

IPC-2511: Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology IPC-2512: Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description IPC-2513: Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description IPC-2514: Sectional Requirements for Implementation of Printed Board Manufacturing Data Description IPC-2515: Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description IPC-2516: Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description IPC-2517: Sectional Requirements for Implementation of Assembly Circuit Testing Data Description IPC-2518: Sectional Requirements for Implementation of Bill of Material Product Data Description EIA-267-C: Axis and Motion Nomenclature for Numerically Controlled Machines EIA-274-D: Interchangeable Variable Block Data Contouring, Format for Positioning and Contouring/Positioning Numerically Controlled Machines EIA-358-C: ANSI X3.4 American National Standard Code for Information Interchange for Numerical Machine Control Perforated Tape

EIA-408: Interface between Numerical Control Equipment on Data Terminal Equipment Employing Parallel Binary Data Interchange EIA-431: Electrical Interface between Numerical Control and Machine Tools EIA-441: Operator Interface Function of Numerical Controls EIA-484-A: Electrical and Mechanical Interface Characteristics and Line Control Protocol Using Communication Control Characters for Serial Data Link between a Direct Numerical Control System and Numerical Control Equipment Employing Asynchronous Full Duplex Transmission EIA-494-B: 32 Bit Binary CL (BCL) and 7 Bit ASCII CL (ACL) Exchange Input Format for Numerically Controlled Machines

EIA-469-C: Standard Test Method for Destructive Physical Analysis of High Reliability Ceramic Monolithic Capacitors EIA-638: Surface Mount Solderability Test EIA IS 46: Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Devices IPC-9501: PWB Assembly Process Simulation for Evaluation of Electronic Components IPC-9502: PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components IPC-9503: Moisture Sensitivity Classification for Non-IC Components IPC-9504: Assembly Process Simulation for Evaluation of Non-IC Components IPC-9701: Qualification and Performance Test Methods for Surface Mount Solder Attachments IPC-9850: Surface Mount Equipment Performance Characterization IPC/JEDEC-9702: Monotonic Bend Characterization of Board-Level Interconnects IPC/JPCA-6801:Terms & Definitions,Test Methods, and Design Examples for Build-Up/High Density Interconnection IPC-TM-650: Test Methods Manual JEDEC Standard 22 Series: Test Methods JEDEC JESD 22-A111: Evaluation Procedure for Determining Capability to Bottom Side Board Attach By Full Body Solder Immersion of Small Surface Mount Solid State Devices JEDEC JESD 22-A112: Test Method A112, Moisture-Induced Stress Sensitivity for Plastic Surface Mount Devices JEDEC JESD 22-B105-B: Test Method Lead Integrity JEDEC JESD 22-B106: Test Method B106c, Resistance to Soldering Temperature for Through-Hole Mounted Devices JEDEC JESD 22-B108: Coplanarity Test for Surface-Mount Semiconductor Devices JEDEC JESD 22-B117: BGA Ball Shear JEDEC JESD 51-8: Integrated Circuit Thermal Test Method Environmental Conditions Junction-to-Board JESD 22-B108: Coplanarity Test for Surface Mount Semiconductor Devices

A.10

IPC-T-50F: Terms and Definitions for Interconnecting and Packaging Electronic Circuits JEDEC JESD 12-1: Terms and Definitions for Gate Arrays and Cell-Based Integrated Circuits JEDEC JESD 77: Terms, Definitions and Letter Symbols for Discrete Semiconductor and Optoelectronic Devices JEDEC JESD 99: Terms, Definitions, and Letter Symbols for Microelectronic Devices JEDEC JESD 100: Terms, Definitions, and Letter Symbols for Microcomputers, Microprocessors, and Memory Integrated Circuits JEDEC JEP 99: Glossary of Microelectronic Terms, Definitions, Symbology