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Laminates Materials have to survive the increased thermal stress of repeated lead-free assembly cycles. Due to the higher melting temperature of lead-free solders, a peak temperature during reflow of 260 C must realistically be expected (30 C to 40 C higher than eutectic soldering profiles). Most printed circuit boards will be required to withstand at least five such assembly cycles, but that number may increase to six and higher for more complex assemblies. A rule of thumb states that a 10 C increase of temperature doubles the reaction energy starting degradation or decomposition of the resin compound.The increased peak temperature therefore requires new or improved laminate materials with a higher decomposition temperature and enhanced thermal stability. New laminate test methodologies are also needed to assess the impact of the higher assembly temperatures. PCB reliability There should not be any degradation in the reliability of the printed circuit boards after assembly compared to boards assembled using traditional soldering profiles. When the same laminate material is used, plated through holes will see an increase in thermal expansion stresses after an equal number of assembly cycles with higher peak temperatures. This means that if the same laminate is used, the reliability margin of the PCB has decreased. To achieve comparable reliability of boards after both eutectic or lead-free soldering, a change

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in the base material is most likely. Additional PCB reliability concerns include innerlayer bonding, conductive anodic filament (CAF) growth, and dielectric strength, particularly with reduced dielectric thicknesses. PCB performance In addition to the preceding reliability challenges posed by lead-free assembly processes, it also has to be guaranteed that all other performance characteristics of the printed circuit board stay the same. This includes dielectrical properties such as dielectric constant Dc (which influences impedance), dissipation factor Df, and thermomechanical properties such as copper peel strength, glass transition temperature, or coefficient of thermal expansion (CTE). These properties should not be affected by the assembly processes applying higher temperatures.

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Material Evaluation Process In almost all cases, the laminate manufacturer will provide a set of data for its specific materials. This datasheet is a good starting point and can certainly be used to evaluate laminates at an early state of a project. Often, though, it will be necessary to perform additional tests in the PCB facility to verify or complement the manufacturer s data to ensure that the laminate materials meet the requirements of manufacturing and assembly processes. This chapter introduces the most important laminate properties and their characterization methods and has been revised to reflect RoHS-compliant manufacturing process and temperature requirements. It will serve as a quick reference guide for the printed circuit board specialist as well as an introduction to laminate testing for those who are new to the field. Laminate properties according to industry standards such as the National Electrical Manufacturers Association (NEMA) and IPC will be introduced. Then the actual test methods will be discussed in the form of a best-practice guide. This guide will help the PCB specialist make quick decisions during the testing process. Methods to test mechanical, thermomechanical, and electrical properties of printed circuit board materials will be described. The focus will be on how the tests are performed, what the results actually mean in today s manufacturing environment, and how relevant the obtained test data are. In addition to the raw base material testing, the chapter will introduce a best-practice qualification guide to assess interactions between manufacturing processes and laminate properties.

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1. JEDS-51.2, Integrated Circuits Thermal Test Method Environment Conditions Natural Convection (Still Air), Section 1.1. 2. The SRC/CINDAS Microelectronics Packaging Materials Database, Purdue University, 1999. 3. Azar, K., and Graebner, J. E., Experimental Determination of Thermal Conductivity of Printed Wiring Boards, Twelfth IEEE Semiconductor Thermal Measurement and Management Symposium, 1996, pp. 169 182. 4. Holman, J. P., Heat Transfer, McGraw-Hill, New York, 1990, pp. 281 368. 5. Lopez, Leoncio D., Nathan, Swami, and Santos, Sarah, Preparation of Loading Information for Reliability Simulation, IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 4, December 2004, pp. 732 735. 6. Vinke, Heinz, and Lasance, Clemens J. M., Compact Models for Accurate Thermal Characterization of Electronic Parts, IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A, Vol. 20, No. 4, December 1997, pp. 411 419.

This chapter presents the elements of data exchange, the data exchange process, its pitfalls and best practices, the most widely used data exchange formats and their main characteristics, and evolution drivers in data exchange The electronics manufacturing marketplace is a dynamic domain where supply chains of trading partners compete in a global economy in which time to market and efficiency are key factors for success Outsourcing is becoming more common; printed circuit board (PCB) fabrication has been outsourced in the 1980s and early 1990s, whereas assembly is following very quickly Data communication is a vital key to supply chain management Efficient and accurate data exchange is an extremely important factor in customer supply networks The challenge of more efficient and accurate data exchange has only recently begun to be addressed and the future for data exchange improvements holds much potential 181.